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Mounting board Product List and Ranking from 13 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Mounting board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 松本加工 Shizuoka//Resin/Plastic
  2. 特殊精機 Tochigi//Electronic Components and Semiconductors
  3. null/null
  4. 4 創成電子 本社・研究所 Yamagata//Manufacturing and processing contract
  5. 5 東洋精密工業 Nara//Electronic Components and Semiconductors
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Mounting board Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding." 松本加工
  2. Special Precision Machinery Co., Ltd. Business Introduction 特殊精機
  3. Tokyo Radar Corporation
  4. 4 High-Density Implementation Products [Contract Design and Manufacturing Examples] 創成電子 本社・研究所
  5. 4 Wafer-level implementation board "Via Wafer"

Mounting board Product List

1～15 item / All 16 items

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High-Density Implementation Products [Contract Design and Manufacturing Examples]

High-Density Implementation Products [Contract Design and Manufacturing Examples]

Designed based on the principle that 'the quality, performance, and cost of a product can be designed.' One-stop contract manufacturing service from product planning and prototyping to mass production.

Our company assists customers from the product planning and design stage with an eye towards mass production. [Example] ■Supports BGA and 0402 size *For more details, please download the materials or feel free to contact us.

  • Circuit board design and manufacturing

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Printed Circuit Board Business Products and Services

Printed Circuit Board Business Products and Services

Improved performance in heat dissipation, dust resistance, and water resistance! Ensures the reliability of the mounted circuit board.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technology, and a quality control framework. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Circuit board processing machine

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[Introduction to Assembly Manufacturing Technology] "Device Manufacturing Technology" that controls products.

[Introduction to Assembly Manufacturing Technology] "Device Manufacturing Technology" that controls products.

All implementation boards are checked by AOI (Automated Optical Inspection) to prevent the outflow of defects!

We would like to introduce the "Device Manufacturing Technology" that controls Kuroi Electric's products. Our company produces the brain of electronic blocks, such as power supply boards and control boards. With advanced chip mounters and axial & radial combination machines, we can mechanically mount mixed boards all at once. By performing moisture-proof insulation treatments and filling processes with materials like silicone, urethane, and Hayacoat, we can also achieve processing that withstands harsh environments, with a proven track record in various products, including outdoor products. 【Features】 ■ Capable of mechanically mounting mixed boards all at once ■ Processing that can withstand harsh environments is also possible ■ Proven track record in various products, including outdoor products *For more details, please refer to the related links or feel free to contact us.

  • Contract manufacturing

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Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.

Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.

We also have detailed materials explaining mold (potting) and coating that can implement measures for waterproofing, humidity resistance, and earthquake resistance of the implementation substrate.

If the printed circuit board is used as is, it often leads to malfunctioning of the board, damage to components or the board itself, and a reduction in the lifespan of the board. Therefore, for printed circuit boards in harsh environments, measures such as waterproofing, moisture-proofing, vibration-proofing, dust-proofing, and explosion-proofing become necessary. As a countermeasure, resin molding (resin potting) can be used to inject urethane resin into cases, which can shut out dust, dirt, water, and vibrations. Additionally, since the board is fixed in place, it can be protected from vibrations. *Consideration for implementation is possible even without a case. Furthermore, by coating the surface of the board, it is possible to protect the board from dust, dirt, and moisture. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent

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Special Precision Machinery Co., Ltd. Business Introduction

Special Precision Machinery Co., Ltd. Business Introduction

We are committed to providing better proposals by closely supporting our customers from substrate assembly to assembly, inspection, repair, and finished products.

Special Precision Machinery Co., Ltd. is an EMS company that has walked alongside "MADE IN JAPAN" manufacturing for many years. Through long-term transactions with major corporations, we can offer comprehensive proposals for production know-how, including consistent quality, process improvements, and precision enhancements at the same labor cost, from prototype development to mass production of finished products. We utilize various equipment and inspection devices that contribute to building quality, achieving high standards. 【Sales Points】 ■ We produce small lots of high-quality, high-density mounted circuit boards with advanced SMT and various inspection equipment, achieving ultra-short delivery times—something other companies are reluctant to do. ■ We operate under the concept that "quality is built upstream," ensuring reliable and stable manufacturing. ■ Our experienced and skilled multifunctional workers manage everything from prototypes to mass production with consistent oversight, pursuing quality and efficiency in manufacturing. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • EMS

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing

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Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."

Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."

"Hot melt molding," which is increasingly being adopted for waterproofing and insulating sealing of substrates and electronic components. We are offering a sample of an LED substrate sealed with hot melt molding for free.

We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)

  • Other Auto Parts
  • Other polymer materials
  • Electrical equipment parts

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Taclum Plus board for MMIC implementation

Taclum Plus board for MMIC implementation

Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.

Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.

  • Other semiconductors

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COB for PWB

COB for PWB

Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.

"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties. By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product. Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks. 【Features】 ■ Chips mounted within the cavity ■ Achieves miniaturization and thinness of devices ■ Supports electrolytic gold plating and electroless gold plating ■ Stable bonding properties ■ Unique mold design reduces dust generation from the edges after exterior pressing *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Ogata Manufacturing Co., Ltd. Business Introduction

Ogata Manufacturing Co., Ltd. Business Introduction

We will utilize our know-how based on experience and achievements to create products that are "kind to people and nature."

At Ogata Manufacturing Co., Ltd., we engage in the mounting of electronic components on printed circuit boards, assembly of various printed circuit boards, manufacturing and assembly of various electronic devices, processing of molded parts (related company), and processing of film sheets, among other activities. We have established a system to meet the diverse needs of our customers. Utilizing our know-how based on past experiences and achievements, we deliver reliable products to our customers. 【Business Activities】 - Mounting and assembly of electronic components on various printed circuit boards - Manufacturing and assembly of various electronic devices (unit assembly and finished product assembly) - Processing of film sheets (cutting, laminating, half-cutting) - Dispatch of specific workers For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Other electronic parts
  • Processing Contract

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Utilized for alternative lighting, traffic lights, and televisions! 'LED Mounting Board'

Utilized for alternative lighting, traffic lights, and televisions! 'LED Mounting Board'

A dedicated printed circuit board equipped with LED elements to efficiently utilize the generated light!

The "LED Mounting Board" is a product handled by Shinko Seisakusho Co., Ltd., which engages in the development, design, manufacturing, and sales of electronic circuit boards. This product is a dedicated printed circuit board that incorporates LED elements, which are the light-emitting parts, to efficiently utilize the generated light. To efficiently reflect and utilize LED light, white substrates and white solder resist are used, and surface treatments include silver plating and gold plating. 【Features】 ■ Equipped with LED elements ■ Uses white substrates and white solder resist ■ Surface treatment includes silver plating and gold plating ■ Heat generated by LED light emission can be managed through through-holes *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board

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[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

We offer a lead-free compatible line, discrete component inserters, inspection equipment, and more!

We would like to introduce the equipment owned by World Electronics Co., Ltd. The SMT L6 line (lead-free compatible line) includes a cream solder printer, adhesive applicator, high-speed component mounter, odd-form component mounter, and a lead-free compatible N2 reflow oven. Additionally, the high-speed axial component inserter "AVK3" supports self-insertion for board sizes (mm) with a maximum of 508×381 and a minimum of 50×50. 【Equipment Owned (Excerpt)】 ■ Flow Soldering Line - Spray Fluxer - Automatic Soldering Equipment: 3 lines for lead-free solder, 1 line for eutectic solder *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Circuit Board Inspection Equipment
  • X-ray inspection equipment

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Transaction Flow

Transaction Flow

First, please feel free to contact us via the inquiry form or by phone!

We would like to introduce the flow of transactions with World Electronics Co., Ltd. First, please contact us via the inquiry form or by phone, and we will gather necessary information such as the type of product, quantity, and delivery date. Based on the information provided, we will create and present a quotation. Once you agree to it, we will proceed with the contract. Next, we will create a prototype and respond sincerely until the desired product is completed. Once the prototype is finished, we will manufacture the product and deliver it according to the desired delivery date. 【Transaction Flow】 1. Inquiry 2. Requirements Hearing 3. Quotation 4. Contract 5. Prototype Creation 6. Manufacturing 7. Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]

High-precision, high-density chip direct mounting on substrates ODM [Technical and field materials provided]

We possess wafer processing, various COB, and flip chip technologies! These can be applied to ultra-small sensor systems, electronic medical devices, and optoelectronic equipment.

AEMtec GmbH offers advanced chip direct mounting technology for optoelectronics and sensor systems. We possess various mounting technologies, including wafer processing, high-precision chip mounting, component mounting, unitization, and modularization. These technologies can be applied to various ultra-small sensor systems, wearable electronic medical devices, and optoelectronic device mounting. 【Mounting Technologies We Offer】 ■ Wafer Processing: UBM, balls, die processing ■ High-Precision Chip Mounting: Flip chip, chip on board ■ Component Mounting: Surface mounting ■ Unitization and Modularization: Providing mounted substrates in special shapes *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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